Ultrasonic Spraying Protective Film Specific Coating Before Silicon Wafer Cutting
Description:
Ultrasonic spraying protective film specific coating before silicon wafer cutting has been proven to be a reliable, repeatable, and efficient method for applying various chemicals to silicon before cutting, grinding, and polishing to protect the wafer and bumps. Common chemical substances include Z-Coat, PMMA, and other easily removable chemicals. FUNSONIC's nozzle system can be customized to meet customers' specific coating requirements and challenges for protective films before silicon wafer cutting.
The ultrasonic spraying protective film specific coating before silicon wafer cutting can be applied to any shape or size by controlling the thickness from submicron to over 100 microns. The coating system is a feasible alternative to other coating technologies such as rotary and traditional spraying.
Parameters:
| Product Type | Laboratory desktop FS620 | Pilot type vertical FS650 | Online production type FS680 | FS1005 | | Spray nozzle operating frequency | 20-200KHz | 100KHz (120KHz或150KHz for select) | | Nozzle power | 10-100W | 2~ 10W | | Continuous spraying volume max | 20-1200ml/h/pcs,Scalable | 0.01-l/min | | Effective spraying width | 2-260mm/pcs,Scalable | 1-5mm | | Spray uniformity | <5% | <5% | | Solution conversion rate | ≥95% | ≥95% | | Dry film thickness | 20nm-100μm | 20nm-1μm | | Solution viscosity | ≤50cps | ≤10cps | | temperature range | 1-60℃ | 1-60℃ | | Atomized particles (median value) | 10-45μm (Distilled water), determined by the frequency of the nozzle | 10-25μm(Distilled water), determined by the frequency of the nozzle | | Diversion pressure max | ≤0.15MPA | ≤0.05MPa | | input voltage | 220V±10%/50-60Hz | 220V±10%/50-60Hz | |
Advantages :
Ultrasonic nozzles have important applications in photolithography processing. Semiconductor manufacturers use ultrasonic spraying technology to spray photoresist developer on silicon and gallium arsenide chip substrates, which is a chemical substance that can display optical stepper imaging circuits. The spraying process involves inserting the nozzle above the chip, and then controlling the ultrasonic nozzle through XYZ three-axis and servo motor to evenly distribute the coating. As the spray of the ultrasonic nozzle is gentle and continuous, it can improve the chemical activity, improve the development efficiency, and reduce rebound and material waste. Data shows that ultrasonic spraying technology can save up to 70% of materials and improve control of critical dimensions.
Compared with traditional spin coating, the advantage of ultrasonic nozzles is that they can distribute materials more evenly and reduce the dependence of liquid distribution on surface tension. Traditional spin coating involves depositing materials in the form of puddles or streams onto a portion of a chip, and then dispersing them onto the surface through centrifugal force. This process requires precise control of temperature and solvent evaporation rate to ensure the integrity and uniformity of the coating. Ultrasonic nozzles, on the other hand, atomize the material onto the entire surface of the chip to form a continuous thin film. This way, there is no need to consider solvent evaporation and surface forces, and there will be no sputtering or backside deposition.
Ultrasonic Spraying Protective Film Specific Coating Before Silicon Wafer Cutting
Product Tags:
|
|
Ultrasonic Spraying Protective Film Specific Coating Before Silicon Wafer Cutting Images
|
